Yunqi Capital Leads A+ Round in HuaiCi Technology to Accelerate Domestic Production of High-End Ceramic Packaging | Yunqi Partners

As AI, optical communications, automotive electronics, aerospace, and other high-end applications continue to advance, integrated circuit packaging is facing ever-higher demands for material performance, structural design, and manufacturing processes. Ceramic packaging housings and substrates — critical foundational components connecting chips to systems — are becoming an increasingly vital link in advanced manufacturing chains.

Recently, Hangzhou HuaiCi Technology completed its Series A+ funding round, co-led by Yunqi Capital and Junshi Venture Capital. This edition of "Yunqi Partners" brings you the details.

Yunqi Capital's Investment Thesis:

HTCC ceramic packaging housings and substrates represent a high-barrier, long-runway segment undergoing structural supply-demand shifts. As domestic downstream customers accelerate multi-sourcing initiatives, local teams with integrated capabilities across materials, equipment, and process are entering a critical window.

HuaiCi Technology has established end-to-end capabilities spanning powders/pastes, sintering, metallization, and advanced packaging testing, with concurrent product development in both alumina and aluminum nitride systems. The path to yield improvement is clear, and SKU expansion is progressing rapidly. We believe the company is positioned to achieve scale first in optical communications, laser, and high-reliability niche applications, while continuing to penetrate higher-end customized use cases.

The following content is republished from "EO Intelligence"

On June 10, 2026, Hangzhou HuaiCi Technology Co., Ltd. ("HuaiCi Technology") announced the completion of its Series A+ funding round. The round was co-led by Yunqi Capital and Junshi Venture Capital; the specific amount was not disclosed.

Founded on February 3, 2023, HuaiCi Technology is a high-tech enterprise focused on the design and R&D of integrated circuit ceramic packaging housings and substrates. The company is dedicated to the development, production, and sales of alumina and aluminum nitride high-temperature co-fired multilayer ceramic packaging housings and SIP packaging substrates, with products widely used in high-end fields including optical communications, wireless communications, industrial lasers, consumer electronics, automotive electronics, aerospace, and infrared detectors.

The Series A+ proceeds will primarily fund HuaiCi Technology's investments in advanced ceramic packaging technology R&D, capacity expansion, and market development. The addition of Yunqi Capital and Junshi Venture Capital will further strengthen HuaiCi Technology's leading position in the integrated circuit packaging sector, driving technological innovation and industrial upgrading.