CoreX Technology
芯爱科技
CoreX Technology (芯爱科技) is a Nanjing-based supplier of advanced packaging substrates for the semiconductor industry . The company has raised substantial venture backing across multiple rounds, starting with a 500-million-yuan Series A1 in April 2023 led by Heli Capital with participation from Junhai Chuangxin, Xiamen Lianhe Capital, and others , followed by a January 2024 round that brought in BYD, Yuexiu Industrial Fund, and Sunriver Capital as new investors, pushing total social-capital raised above 2.5 billion yuan . As of September 2025, the company announced plans to invest over 300 million yuan in capacity expansion and equipment upgrades across three core production lines .
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Coverage
Rongbao | Multiple autonomous driving, nuclear fusion, gaming, and innovative drug companies raise hundreds of millions of RMB in funding
From commercial deployment to world-first breakthroughs, innovation never stands still.
Xin'ai Technology Completes New Funding Round to Advance R&D and Mass Production of High-End Packaging Substrates
Accelerate the pace of scaled mass production and strengthen industrial layout in the automotive sector.
Chip/Consumer Electronics/Gene Editing Firms Raise New Funding; Quantum Computers, Micro-Display Chips Achieve Global Leadership | Rongbao · April
Targeting international advanced standards.
Advanced packaging substrate supplier **XinAi Technology** (芯爱科技) has raised over **500 million yuan** in its Series A1 funding round.
We aim to achieve domestic production and supply chain independence in the high-end substrate space.
