ESWIN Computing

ESWIN Computing (奕斯伟计算) is a Beijing-based chip company founded in 2019 that builds RISC-V architecture processors and solutions . It raised over RMB 3 billion in its Series D round in mid-2023, led by Financial Street Capital with co-investment from National Integrated Circuit Industry Investment Fund Phase II . The company has developed a full-stack platform with self-designed 32-bit and 64-bit CPU IP cores spanning energy-efficient, high-performance, and automotive-grade variants, including functional-safety IP certified to ASIL-B/D standards .

Its product line has expanded from embedded and edge-computing applications into AI PCs and automotive chips. In 2024 it unveiled the EIC7702X, an AI PC chip with an 8-core out-of-order 64-bit RISC-V processor and self-developed NPU capable of running 50-channel HD video decoding and large-model workloads . By early 2025 it had adapted its RISC-V AI SoC EIC77 series to run DeepSeek models , and at the April 2025 Shanghai Auto Show it announced a "camera-to-screen" intelligent cockpit solution for vehicle display and control systems . The company also presented edge-computing products at the 2024 RISC-V Europe Summit .