ESWIN Computing

ESWIN Computing is a Chinese chip design company founded in 2019 that builds RISC-V-based computing architectures and AI chips . Its flagship product, the EIC7702X, is a high-performance AI PC chip built on an 8-core 64-bit out-of-order RISC-V processor with a self-developed neural processing unit (NPU), designed to accelerate generative AI workloads and support up to 50-channel HD video decoding . The company has developed a full-stack platform with proprietary 32-bit and 64-bit CPU IP series spanning energy-efficient, high-performance, and security-enhanced variants, plus automotive-grade IP certified to ASIL-B/D standards . In 2023, ESWIN Computing closed an over RMB 3 billion Series D round led by Financial Street Capital, with participation from the National Integrated Circuit Industry Investment Fund Phase II . It is distinct from ESWIN Material, a separate silicon wafer manufacturer under the same corporate umbrella that raised nearly RMB 4 billion in its Series C round .