Xingyun Integrated Circuit

Xingyun Integrated Circuit (行云集成电路) is a Beijing-based AI chip startup founded in August 2023 by CEO Yu Ji (季宇), a Tsinghua University computer science PhD and former member of Huawei's "Genius Youth" program who worked on Ascend AI chip compiler and architecture development at Huawei HiSilicon . The company focuses on next-generation inference chips for large language models, aiming to build ultra-large memory, CUDA-compatible GPGPU products using a non-3D DRAM architecture to drive down AI inference costs .

CTO Yu Hongmin (余洪敏), a Chinese Academy of Sciences semiconductor PhD, previously led development and mass production of Baidu's Kunlun chips and Huawei's Ascend chips, with over ten successful tape-outs to his name . Xingyun has taken what FreeS Fund described as a "heterogeneous + white-box" technical approach, balancing system performance, software compatibility, and forward-looking design for evolving model architectures .

The company raised over 400 million RMB in combined Pre-A and Pre-A+ rounds by mid-2026, with 5Y Capital, SAIF Partners, and Primavera Capital as co-leads, alongside Beijing and Jiangsu state capital, memory maker Biwin Storage, and industry investors including GPU entrepreneur family offices and Skyworth Capital . FreeS Fund, which led the angel round, remains an early backer . Yu Ji has framed the company's mission as pushing AI democratization to return the market to "an era where people are more expensive than machines" .