Adaps Photonics Closes B1 Round to Double Down on High-Performance dToF Depth Sensor Chips
Developing advanced sensing chips for industry, creating "eyes of insight" for the future.
Adaps Photonics (hereinafter referred to as "Adaps") recently announced the completion of its Series B1 financing round, raising tens of millions of RMB. Gaorong Ventures led the round, with participation from OPPO, Kinzon Capital, ZhenFund, and OFILM Group.
The proceeds will fund continued R&D of advanced direct time-of-flight (dToF) sensing technology, recruitment of top engineering talent, and expansion of its product portfolio from consumer electronics into adjacent fields including solid-state LiDAR and AR devices.
Founded in May 2018 by four PhD returnees from leading international universities, Adaps is dedicated to developing high-performance dToF depth sensor chips based on internationally leading single-photon avalanche diode (SPAD) technology for applications spanning smartphones, LiDAR, robotics, and VR/AR devices. In October 2020, the company received investment from Xiaomi Changjiang Industry Fund.
3D sensing technology is expanding into cutting-edge application areas including consumer electronics, automotive electronics, and industrial control. Among these, dToF (direct time of flight) technology based on SPAD detectors represents the forefront of 3D sensing — measuring target distance by detecting the flight time (round-trip) of light pulses to achieve 3D imaging. With its superior ranging capability, power efficiency, and anti-interference performance, dToF has drawn increasing industry attention in recent years. Market demand for advanced dToF imaging chips exploded particularly after Apple released its dToF-equipped LiDAR Scanner ecosystem in 2020 and Sony unveiled its automotive LiDAR solution using dToF technology.
In July 2021, Adaps officially launched its independently developed ADS3003 dToF single-photon imaging sensor, fabricated using globally advanced backside-illuminated 3D stacking process technology. With comprehensive performance reaching world-class standards, it offers a groundbreaking solution for high-end consumer electronics, LiDAR, and other 3D perception applications. This marked China's first dToF sensor chip employing 3D stacking technology; to date, fewer than five companies worldwide are known to have shipped 3D-stacked dToF chip products.
Adaps ADS3003 chip
The ADS3003 features a physical resolution of 240×160, a 0.35-inch optical format, measurement range of up to 26 meters indoors and 10 meters outdoors, and maximum frame rate of 60fps. It achieves sub-centimeter ranging accuracy and depth resolution across the full measurement range, addressing requirements from smartphones and AR devices to robot vacuums, smart home IoT, and industrial measurement applications. Adaps jointly launched a dToF module solution based on this chip with OFILM Microelectronics, and has begun providing samples and evaluation kits to customers. The chip has reached initial mass-production readiness.
Adaps stated that it will continue deepening its position in the consumer electronics dToF segment. OPPO's strategic investment will advance the company's consumer electronics footprint and accelerate dToF chip adoption and mass production in smartphones. Meanwhile, with the rise of solid-state LiDAR and AR devices, the dToF sensing market will continue growing and rapidly diversifying. Adaps is actively developing solid-state LiDAR chips and AR dToF chip products, and expects to establish deep partnerships with multiple industry leaders.
Kai Zang, CEO of Adaps Photonics, commented: "Our team's years of focused work in dToF technology and relentless product refinement have earned recognition from customers and partners for both our technical leadership and product performance. The addition of strategic partners like OFILM, Xiaomi, and OPPO has significantly strengthened our strategic positioning, while validation from outstanding investors like Gaorong Ventures reinforces our confidence in our current development path. Our entire team is driven to contribute the highest-quality dToF chip products to the industry in the near future."
Bin Yue, founding partner of Gaorong Ventures, said: "3D sensing technology is rapidly penetrating consumer electronics, automotive electronics, and industrial control. The Adaps founding team has solid technical foundations and exceptional product development capabilities in dToF sensing. We have strong conviction in this team and look forward to their continued delivery of world-class 3D sensing chips that enable transformative advances in 3D perception across consumer and industrial applications."
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