Biren Technology Completes Series B Funding, Advancing China's Semiconductor Innovation Through Technology
Dedicated to achieving breakthroughs in domestic high-end general-purpose intelligent computing chips.
Biren Technology, a general-purpose intelligent chip design company, recently announced the completion of its Series B funding round. In just over a year since its founding, Biren Technology has raised more than 4.7 billion RMB in total financing, setting records for both fundraising speed and scale in this sector and establishing itself as the fastest-growing "unicorn" enterprise. The robust financial moat built in such a short timeframe will serve as a critical foundation for Biren Technology to continue attracting top industry talent, lead technological innovation, and drive large-scale commercial deployment.
Biren Technology's Series B round continued to receive strong support from numerous well-known strategic and financial investors. This round was co-led by Ping An Insurance, New World Development Group, and Country Garden Venture Capital, with participation from many other prominent institutions. Gaorong Ventures had previously invested in the company's Pre-B round in August 2020.
Founded in 2019, Biren Technology is dedicated to developing original general-purpose computing architectures, building efficient software and hardware platforms, and providing integrated solutions in the intelligent computing space. In terms of development strategy, Biren Technology will first focus on cloud-based general-purpose intelligent computing, gradually catching up with existing solutions across AI training and inference, graphics rendering, and high-performance general-purpose computing — achieving breakthroughs in domestically produced high-end general-purpose intelligent computing chips.
Since its establishment, Biren Technology has not only completed multiple funding rounds backed by top-tier investment firms in rapid succession, but has also achieved numerous milestone breakthroughs in product R&D and talent team building.
Wen Zhang, founder, chairman, and CEO of Biren Technology, stated: "High-end general-purpose intelligent chip design is both a foundational pillar and a mountain pass fraught with challenges. Ubiquitous application scenarios have made the goal of domestic autonomy in general-purpose intelligent chip design a top priority for China's technological development and industrial upgrading. At the same time, the industry's characteristics of high difficulty, long cycles, and large-scale systems have deterred many entrepreneurs. Over the past year, Biren Technology has remained committed to its original mission of 'using technological innovation to power China's chips,' and with the resolve to 'stand as steep as a ten-thousand-ren cliff,' has steadily advanced toward building truly internationally competitive high-end chips by aggregating industrial capital, talent, and resources."
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