Jingneng Microelectronics Completes RMB 500 Million Series B Funding Round to Continue Developing High-Reliability Power Semiconductors
Continue investing in R&D and innovation.
On October 25, Zhejiang Jingneng Microelectronics Co., Ltd. ("Jingneng") completed a 500 million yuan Series B round led by Xiuzhou Linghang Fund — the company's fourth funding round to date. Gaorong Ventures previously participated in Jingneng's Pre-A round in 2022 and led its Series A in 2023.
Jingneng is a power semiconductor subsidiary of Geely, focused on developing high-reliability power semiconductor products with the goal of becoming a technology leader in the industry.
Backed by Geely's global industrial resources, Jingneng has built an industry-leading R&D and manufacturing system. The company maintains a user-centric approach and focuses on technological innovation, offering differentiated, customized solutions spanning materials, chips, and modules.
The company currently operates three intelligent production bases in Yuhang, Wenling, and Xiuzhou, equipped with advanced equipment and top talent from specialized fields worldwide. It has successfully developed and deployed dozens of chip and module products including silicon-based MOSFETs, IGBTs, FRDs, and silicon carbide-based MOSFETs. These products serve new energy applications such as electric vehicles, wind and solar power storage and charging, and robotics.
Going forward, Jingneng will continue investing in R&D and innovation, strengthening its competitiveness across design, process, and application to deliver outstanding semiconductor solutions for its customers and drive green transformation and sustainable development across the industry.
