Jingneng Microelectronics has completed its Series A funding round, led by Gaorong Ventures.

Zhejiang Jingneng Microelectronics Co., Ltd. ("Jingneng") recently completed its second funding round, led by existing investor Gaorong Ventures. Geely Capital, Xiamen C&D, Chunshan Capital, Tsinghua Holdings Zhaoshang, Puhua Capital, China-US Green Fund, Guxin Holdings, Zhonghe Wanfang, and Xiangtan Industry Revitalization participated as co-investors. Gaorong Ventures previously invested in Jingneng's Pre-A round in 2022.

As Geely's power semiconductor subsidiary, Jingneng focuses on the development and innovation of Si IGBT and SiC MOSFET technologies, leveraging integrated capabilities in chip design, module manufacturing, and automotive-grade certification to deliver high-performance power products and services for new energy vehicles, electric motorcycles, photovoltaics, energy storage, and new energy vessels.

In March 2023, Jingneng announced the successful tape-out of its first self-developed automotive-grade IGBT product. The new chip met all design specifications, marking a "chip" milestone in Jingneng's IGBT technology development and laying groundwork for subsequent power chip R&D. The company has also recently announced that its 750V platform IGBT chip for passenger vehicle motor control systems has entered mass production, and its 1200V platform IGBT for commercial vehicles has achieved successful tape-out. Its self-developed modules have demonstrated excellent performance and secured design wins for select vehicle models.

Going forward, Jingneng will continue advancing its established goals in power semiconductor design R&D, module manufacturing, and vehicle integration.