Gaorong Ventures Congratulates ESWIN Computing on Hong Kong IPO, Marking New RISC-V+AI Chapter
The First RISC-V Stock
On October 9, 2026, ESWIN Computing officially listed on the Main Board of the Hong Kong Stock Exchange under the ticker 01256.HK. This IPO marks a significant milestone in ESWIN Computing's development. Building on this new starting point, the company will continue to deepen industrial collaboration, steadily refine its RISC-V chip technology and products, and jointly build the RISC-V ecosystem.
Gaorong Ventures participated in ESWIN Computing's Series B financing in 2020. ESWIN Computing is also the fifth Gaorong portfolio company to successfully list on the Hong Kong stock market in 2026.


Committed to the RISC-V + AI Technology Path, Building a Full-Stack Self-Developed Technical Foundation
As the AI industry rapidly evolves toward on-device inference and Agentic AI applications, RISC-V (the "fifth-generation reduced instruction set computing architecture") has quickly emerged as the third pillar of global computing architectures, thanks to its open-source, flexible, modular, and energy-efficient characteristics. According to Frost & Sullivan data, China's RISC-V main control chip market grew from 1.1 billion yuan in 2021 to 37.7 billion yuan in 2025, representing a compound annual growth rate of 139.5%, and is projected to reach 219.4 billion yuan by 2030. With an increasingly mature software and hardware ecosystem, RISC-V is continuously expanding its application scenarios and entering a golden window for industrialization and large-scale development.

ESWIN Computing adheres to its "RISC-V + AI" core strategy, operating in a fabless model with products covering chips and system solutions for human-machine interaction and multimedia processing, as well as interconnection and computing, serving diverse scenarios including consumer terminals, automotive electronics, robotics, and industrial control. As of March 31, 2026, the company has accumulated over 620 IP modules, more than 20 series of RISC-V cores, over 1,740 patent applications, launched more than 150 software-hardware collaborative products, and serves 220 global customers.
Leveraging the reusable, platform-based capabilities of its IP and cores, the company efficiently completes new product development and iteration, upgrading from chip shipment to integrated software-hardware system-level solution delivery. Meanwhile, ESWIN Computing is deeply involved in global RISC-V standard-setting as a board member of RISC-V International and rotating chair unit of China's RISC-V Industry Alliance; it has built the RISAA (RISC-V + AI) ecosystem technology platform, initiated and serves as the first chair unit of the RDI (RISC-V Digital Infrastructure) Alliance, collaborating with industry partners to promote ecosystem coordination and drive large-scale RISC-V deployment in edge computing, data centers, and other scenarios — advancing from technology provider to ecosystem co-builder.


Steady Revenue Growth with a Solid Foundation; Computing Business Accelerating
From 2023 to 2025, ESWIN Computing's revenue reached 1.752 billion yuan, 2.025 billion yuan, and 2.431 billion yuan respectively, representing a three-year compound growth rate of approximately 17.8%; Q1 2026 revenue was 494 million yuan, up 18.4% year-over-year, maintaining a steady upward trajectory.
Human-machine interaction chips represent ESWIN Computing's stable business foundation. By 2025 revenue, the company ranks as a leading domestic provider of human-machine interaction chips for smart terminals in China, with products widely used in mobile phones, laptops, in-vehicle displays, and other terminals, providing sustained and stable cash flow for R&D innovation.

Computing chip businesses represented by automotive-grade and robotics applications have achieved rapid growth, with revenue rising quickly from 375,000 yuan in 2023 to 320 million yuan in 2025, and continuing substantial growth in Q1 2026, successfully penetrating high-value tracks such as automotive and industrial sectors.

The proceeds from this IPO will be used for chip product iteration and R&D, RISAA software-hardware platform capability upgrades, potential strategic acquisitions, marketing network development, and RISC-V ecosystem construction, providing solid capital support for product expansion, technology breakthroughs, and industrial collaboration.
Looking ahead, ESWIN Computing will continue to deepen its presence in human-machine interaction, multimedia processing, interconnection, and computing chip products, solidify its full-stack self-developed technical advantages, collaborate with industry partners to build an open and coordinated RISC-V ecosystem, seize the opportunities brought by the explosion of AI computing power, and drive the open RISC-V computing architecture to unlock greater industrial value.
Gaorong Ventures stated: "We warmly congratulate ESWIN Computing on its successful Hong Kong listing! Since our investment in 2020, we have consistently held confidence in the company's long-term development due to Dongsheng Wang's strategic vision, global perspective, and dedication to China's advancement, as well as the team's spirit of steadfast innovation. From the large-scale application of smart terminal chips to the deployment of Embodied Artificial Intelligence products and edge AI computing layout, the company has continuously expanded the commercial space for RISC-V. More importantly, the company has built an open, reusable RISAA (RISC-V + AI) ecosystem technology platform, enabling industry partners to more efficiently develop customized chips adapted to diverse scenarios and accelerating industrial innovation in the AI era. This listing as the 'first RISC-V stock' on the Hong Kong market is both an important milestone for the company and injects new momentum into RISC-V commercialization and global ecosystem development. As AI integrates into thousands of industries, we are optimistic about the vast opportunities for this open architecture and look forward to ESWIN Computing working with global partners to bring more innovative achievements to large-scale application."


