SUNMMIO Closes Pre-A2 and Series A Rounds to Accelerate 3D AI Chip Mass Production

On October 14, SUNMMIO, a MaHui member company focused on R&D and mass production of 3D-architecture AI cloud high-compute chips, announced the completion of its Pre-A2 round (including its pro-rata participation) and Series A financing, with total funding raised in the past year nearing RMB 2 billion.

Source Code Capital led the company's Pre-A round.

The proceeds will be used to expand top-tier R&D talent, accelerate core technology iteration, and speed the mass production and commercial deployment of its self-developed 3D TokenPU large-model compute chips — positioning the company to seize the strategic opportunity of the trillion-scale large-model inference market explosion.

The Pre-A2 and Series A rounds were led by Beijing E-Town International Investment & Development Co., Ltd. and other Beijing municipal and district-level state capital platforms. Beyond providing capital support and multi-tier policy resources, these investors will leverage their industrial connectivity advantages to drive deep linkage between SUNMMIO and manufacturing, packaging, and large-model application partners within the E-Town district, promoting cross-entity collaborative innovation and facilitating supply chain and production capacity resource matching — accelerating the full-chain path of 3D TokenPU chips toward scaled industrial deployment.

Over the past year, the company has completed multiple financing rounds, with investors covering state capital platforms including China Development Bank Capital, Beijing Industrial Investment, Beijing Shunxi Private Equity Fund Management Co., Ltd., and Beijing Zhongguancun Science City Innovation Development; leading market-oriented institutions including Source Code Capital, Xiang He Capital, and Jiayu Capital; and first-tier industrial funds including ShiXi Capital, Lenovo Capital and Incubator Group, and Zhiwei Capital — with some investors making follow-on commitments.

This multi-layered capital endorsement, spanning state capital and industrial chain investors, demonstrates the market's strong recognition of SUNMMIO's 3D TokenPU technical roadmap, mass production capabilities, and commercial prospects. It also provides more robust resource support and credibility backing for the company's subsequent acceleration of product R&D iteration, deepening of domestic 3D IC supply chain collaboration, and building of an independent compute innovation ecosystem.

As a chip company native to the large-model era, SUNMMIO pioneered the 3D TokenPU architecture, focusing on extreme energy efficiency for large-model inference scenarios.

In June this year, the first-generation 3D TokenPU product, A4E, officially taped out. Using a relatively mature domestic process node and supply chain system, it employs 3D hybrid bonding technology to vertically stack eight layers of memory wafer atop logic wafer, achieving ultra-large memory bandwidth of 16 TB/s — breaking through the "memory wall" bottleneck and fully unleashing the technical dividends of native 3D architecture. With core advantages of high bandwidth, high energy efficiency, and high cost-performance ratio, it empowers the domestic compute industry to achieve independent leap-forward development and global expansion.

Underpinning this technical roadmap is the nearly seven years of deep cultivation by SUNMMIO's core team members in the 3D IC field. Over these seven years, the core team, together with supply chain partners, pioneered the Wafer-on-Wafer hybrid bonding 3D IC supply chain in mainland China, accumulating mass production experience across tens of thousands of 3D IC wafers and cumulative revenue exceeding RMB 1.2 billion. This provides full-chain engineering support — from design, through wafer bonding, to volume shipment — for 3D-architecture AI chips to move from technical innovation to scaled mass production.

"The explosion of large-model inference is, at its core, an extreme test of compute energy efficiency," said Dr. Fuquan Wang, founder and CEO of SUNMMIO. "From day one, SUNMMIO chose to use the 3D TokenPU architecture native to the large-model era, bypassing the traditional path of general-purpose GPUs and focusing on extreme energy efficiency for token processing. Going forward, we will accelerate the mass production and delivery of 3D TokenPU, working hand in hand with supply chain and ecosystem partners to make AI compute truly as accessible as water, electricity, and gas in the intelligent era — becoming ubiquitous infrastructure."