Silicon Integrated, a ToF chip design company, announced the completion of a 180 million yuan Series B funding round.

源码资本·June 1, 2020·0·4

Focused on high-performance analog and mixed-signal chip technologies and their applications, it has served tens of millions of flagship-brand smartphones.

On June 1, 2020, Silicon Integrated, a leading designer of Time-of-Flight (ToF) sensor chips, announced the completion of a new funding round led by Heli Capital with participation from Source Code Capital, raising RMB 120 million. **Combined with a previous RMB 60 million co-investment from Lakeside Capital, The Jiangmen, and a prominent smartphone supply chain fund, the company has secured a total of RMB 180 million in its Series B round.

Founded in January 2016, Silicon Integrated is a company focused on high-performance analog and mixed-signal chip technology and applications. Headquartered in Wuhan, it operates R&D and sales centers in Shenzhen, Shanghai, Europe, and the Americas. The company currently has two major product lines — 3D vision and smart audio — and holds dozens of independent intellectual property rights. In March of this year, it released China's first back-illuminated, high-resolution ToF sensor chip with fully independent IP, suitable for high-precision applications such as facial recognition and 3D modeling. Its smart audio amplifiers, meanwhile, have achieved mass production at mainstream smartphone manufacturers thanks to their excellent performance and reliability, with audio solutions already serving tens of millions of flagship-brand devices.

In April, Apple released the new iPad Pro equipped with ToF LiDAR technology, sketching out a world where reality and virtuality blend together, evolving human-machine interaction into human-world interaction. Liu Deheng, founder and CEO of Silicon Integrated, said: "This revolutionary product symbolizes the arrival of the AR era, and the world of AR begins with 3D reconstruction of real environments. Silicon Integrated is deeply building core technologies in 3D perception, advancing the deployment and development of multi-sensory fusion technology through our accumulation in 3D vision, spatial audio, and haptic sensing. In addition to scaling up mass production of back-illuminated high-resolution ToF and smart audio products, this round of funding will also be invested in R&D for LiDAR, optical sensing, and multi-sensory fusion technologies."

Xingchen Zhang of Source Code Capital stated: "3D sensing chips and modules represented by ToF are becoming next-generation technology infrastructure. This is Source Code Capital's first investment in the chip sector. We see vast market potential in 3D perception from the application layer, and are committed to deeply linking content with upstream technology. Silicon Integrated is not only a chip company in the 3D perception space — it also has the capability to define and differentiate through software and algorithms. We have high expectations for what the team can achieve."