MaHui | Optical Communication Chip Designer Lexi Technology Announces Two Rounds of Financing Totaling Several Hundred Million Yuan, Source Code Capital Leads Pre-A Round

#MaKe Source Code Capital and MaHui Member Updates

Recently, Lexin Technology (Guangzhou) Co., Ltd. ("Lexin Technology"), a leading optical communications chip company, completed two funding rounds totaling over 100 million yuan. Source Code Capital led the Pre-A round, with Xinyang Ventures, Delian Capital, and existing investor Legend Star participating. The Series A was led by China Fortune-Tech Capital, with existing investor Source Code Capital and China Fortune-Tech following on. The proceeds will be used for R&D, product portfolio expansion, mass production and delivery, as well as marketing for high-speed optical communications products — ensuring the three pillars of R&D, manufacturing, and market development advance in tandem.

Founded in 2020, Lexin Technology focuses on internationally leading high-speed optoelectronic chip R&D, committed to providing industry-leading interface chips and solutions for customers. Its products are widely used in data centers, communications base stations, and other applications. The company's core team brings mature high-speed chip design experience, extensive mass production expertise with advanced processes, strong engineering execution and delivery capabilities, and the technical reserves and evolution capacity needed for future markets.

Over the past two years, Lexin Technology has maintained a reverence for technology, devoting itself to research and refinement. In 2022, it completed the design and mass production of 100G/400G high-speed optoelectronic integrated circuits. It now provides ultra-low-power integrated product solutions for telecommunications and data center applications, leveraging leading TIA/Driver/CDR technology.

The company targets the domestic substitution of high-speed chips and leading custom chip solutions, with product lines covering telecommunications, data communications, wireless, and access applications. It focuses particularly on addressing the chokepoint of imported components for core chips in WDM (coherent) optical modules and high-speed data center optical modules. Its single-wave 100G TIA is compatible with both PD and APD use, with module-level OMA sensitivity reaching -12.5dBm and -15.5dBm respectively — already at the industry's top tier. Meanwhile, the latest 400G TIA achieves power consumption of just 0.6W, with the 800G TIA further reducing this to 1.1W, providing data center customers with an extreme power-saving solution.

Wanrong Zhao of Source Code Capital said: "The Lexin team embodies both the boldness of young entrepreneurs — daring to push at the cutting edge of technological innovation — and the steadiness of chip developers, with tape-outs and mass production shipments proceeding in an orderly fashion. We look forward to the company carving out its own place in the vast ocean of data center-related electrical chips."

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