Heli Capital
和利资本
Heli Capital (和利资本) is a Chinese venture capital firm focused on semiconductor and hard-tech investments. It led the Series A1 round for advanced packaging substrate supplier CoreX Technology (芯爱科技) in April 2023, which raised over 500 million yuan , and was a lead investor in Silicon Integrated (聚芯微电子), a ToF sensor chip design company, participating in its 120 million yuan Series B in June 2020 and following on in later rounds . The fund's activity clusters in chip design and advanced packaging, typically investing at the Series A to B stage alongside other established Chinese tech investors such as Source Code Capital. elsewhere's corpus does not cover its founding date, AUM, or full team.
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Coverage
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Targeting international advanced standards.
Advanced packaging substrate supplier **XinAi Technology** (芯爱科技) has raised over **500 million yuan** in its Series A1 funding round.
We aim to achieve domestic production and supply chain independence in the high-end substrate space.
Source Code Capital portfolio company Silicon Integrated announced the completion of a Series C financing round of several hundred million yuan. Source Code Capital was an investor in the company's Series B round.
Secured strategic investments from three major smartphone brands
Silicon Integrated, a ToF chip design company, announced the completion of a 180 million yuan Series B funding round.
Focused on high-performance analog and mixed-signal chip technologies and their applications, it has served tens of millions of flagship-brand smartphones.
