Houmo Manjie M50

Houmo Manjie® M50 is an edge-side large-model AI chip produced by Houmo AI (后摩智能), a Qiming Venture Partners portfolio company. Launched in July 2025, the M50 delivers 160 TOPS INT8 / 100 TFLOPS bFP16 compute at a typical power draw of just 10W, paired with up to 48GB memory and 153.6GB/s bandwidth — enough to run 1.5B to 70B parameter models locally on PCs, voice devices, and robots . The chip uses an innovative processing-in-memory architecture and multi-die interconnect for scalable performance, and by late 2025 had completed deep compatibility certification with Kylin OS V11 . At WAIC 2026, Houmo showcased M50 Inside terminals spanning Agent Computers, embodied robots, and edge inference, with partnerships already in place with Lenovo, Great Wall, China Mobile, and other leading OEMs to drive commercial scale in AI PCs, desktop robots, and AI NAS devices . The company is now developing next-generation DRAM-PIM technology targeting over 1TB/s in-memory bandwidth and triple the energy efficiency .