Jingneng Microelectronics
晶能微电子
Jingneng Microelectronics (晶能微电子) is a power semiconductor company founded in June 2022 under Geely Technology Group, serving as the conglomerate's power and AI semiconductor industrial platform . The company focuses on developing automotive-grade power semiconductors, specifically Si IGBT and SiC MOS devices, with an integrated capability spanning chip design, module manufacturing, and vehicle-grade certification .
The company has raised four funding rounds to date, with Gaorong Ventures participating since its 2022 Pre-A round and leading its 2023 Series A . Its most recent financing was a RMB 500 million Series B in October 2024 led by Xiuzhou Linghang Fund . Jingneng operates three intelligent production bases in Yuhang, Wenling, and Xiuzhou—the latter a 95.4-acre facility in Jiaxing National High-Tech Zone that began production in late 2025 with an annual capacity of 600,000 automotive-grade power modules .
By late 2025, the company had achieved mass delivery of vehicle-grade SiC modules exceeding 10,000 units monthly for Zeekr's full vehicle lineup, while expanding into low-altitude economy and embodied intelligence sectors through partnerships with eVTOL and robotics firms including WoFeilongkong and Unitree .
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Coverage
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高榕创投·Jingneng Microelectronics Completes RMB 500 Million Series B Funding Round to Continue Developing High-Reliability Power Semiconductors
Continue investing in R&D and innovation.
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高榕创投·Jingneng Microelectronics has completed its Series A funding round, led by Gaorong Ventures.
Advancing the design, R&D, manufacturing, and application of power semiconductors.
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高榕创投·Jingneng Microelectronics Completes First Funding Round to Develop Automotive-Grade Power Semiconductors
Serving new energy vehicles, electric motorcycles, photovoltaics, energy storage, and other "dual carbon" industry scenarios.
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