Adaps Photonics
灵明光子
Adaps Photonics (灵明光子) is a Shenzhen-based developer of high-performance dToF depth sensor chips, founded in May 2018 by four PhD returnees . The company specializes in single-photon avalanche diode (SPAD) technology for 3D sensing applications spanning smartphones, lidar, robotics, and VR/AR devices .
Its breakout product was the ADS3003, released in July 2021 as China's first dToF sensor built with backside-illuminated 3D stacking technology—a process previously seen only in Apple and Sony's joint development for iPad Pro and iPhone lidar, with Adaps claiming its chip exceeded that benchmark in resolution and ranging capability . By 2025, the company had expanded into four product lines: SiPM photodetectors with AEC-Q102 automotive certification and over 10 million units shipped; the Hummer series for consumer applications like robot vacuums and smart bathrooms; the Swift line for solid-state lidar in cleaning robots; and the HAWK series, featuring what it calls the world's first 440,000-pixel dToF array for pure solid-state lidar with 200-meter range .
On the funding side, Gaorong Ventures led the company's tens-of-millions RMB B1 round in 2021 and continued to participate in subsequent rounds , while ZhenFund backed it from the angel stage onward . The company closed a C2 round in mid-2024 to accelerate R&D and mass production of high-end 3D camera chips .
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真格基金·Adaps Photonics Closes Series C2 Round to Accelerate R&D and Mass Production of High-End 3D Camera Chips
In 2023, it developed the world's highest-pixel SPAD array chip at the time.
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高榕创投·3D Sensor Chip and Solutions Provider Adaps Photonics Closes Hundreds-of-Millions RMB C+ Round
Accelerate the application of dToF technology in automotive, consumer electronics, and XR.
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高榕创投·Adaps Photonics Closes Hundreds of Millions of RMB in Series C Funding, Global Leader in 3D Sensor Chip Technology
Deeply embedding itself in high-growth application markets such as smartphone 3D sensing, automotive LiDAR, and AR devices — building the "perceptive eyes" of the digital world.
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高榕创投·Adaps Photonics Closes B1 Round to Double Down on High-Performance dToF Depth Sensor Chips
Developing advanced sensing chips for industry, creating "eyes of insight" for the future.
高榕创投·Adaps Photonics has released China's first dToF sensor built with 3D stacking technology, offering a groundbreaking solution for 3D sensing.
Overall performance reaches world-class standards.
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