Adaps Photonics

Adaps Photonics (灵明光子) is a Chinese photonics chip company focused on 3D sensing and high-speed optical communications, led by chairman and CEO Zang Kai . ZhenFund backed the company at its angel round and participated in subsequent rounds , and as of mid-2024 the company had raised tens of millions of yuan in a C2 round led by Jintou Dingxin . Its product lines include SiPM and SPADIS chips that had completed automotive-grade certification by September 2024 , and it positions itself as a leader in global 3D camera chips . The company has picked up state-level recognition including a "key little giant" (重点小巨人) designation and NextGen Tech 30 honors as of late 2025 , plus a 2024 "China Core" award for technical innovation .